Copyright (c) 2013 AJC
This work is licensed under a Creative Commons Attribution 4.0 International License.
Sn/Nano-SiC Composite Electrodeposition Technology
Corresponding Author(s) : Maozhong An
Asian Journal of Chemistry,
Vol. 25 No. 11 (2013): Vol 25 Issue 11
Abstract
A Sn/nano-SiC composite electrodeposition technology was studied. The effects of electrodeposition behaviour were investigated by the concentration of main salt, the concentration of methylsulfonic acid, current density etc. The influence law of particles content in the solution on the particle content in Sn/nano-SiC composite coating was also studied. The results show that, when the concentration of Sn2+ was 0.21-0.24 mol/L, the concentration of methylsulfonic acid was 90-120 g/L, current density was 1.5-2.5 A/dm2, there was a higher deposition rate in the electrodeposition process, current efficiency and throwing power were both above 90 %. The nano-SiC content in composite coating was increased with SiC content in bath increasing, when it was 5 g/L, SiC content in composite coating was highest.
Keywords
Download Citation
Endnote/Zotero/Mendeley (RIS)BibTeX
- J.Q. Zhang, M.Z. An, L.M. Chang and G.Y. Liu, Electrochim. Acta, 53, 2637 (2008).
- K. Vathsala and T.V. Venkatesha, Appl. Surf. Sci., 257, 8929 (2011).
- H.Y. Zheng and M.Z. An, J. Alloy. Comp., 459, 548 (2008).
- Y.J. Xue, J.S. Li, W. Ma and M.-D. Duan, J. Mater. Sci., 41, 1781 (2006).
- C. Zanella, M. Lekka and P.L. Bonora, Surf. Eng., 26, 511 (2010).
- H.K. Lee, H.Y. Lee and J.M. Jeon, Met. Mater. Int., 14, 599 (2008).
- H. Li, Y.Z. Wan, H. Liang, X.L. Li, Y. Huang and F. He, Appl. Surf. Sci., 256, 1614 (2009).
- F.Y. Hou, W. Wang and H.T. Guo, Appl. Surf. Sci., 252, 3812 (2006).
- M.-C. Chou, M.-D. Ger, S.-T. Ke, Y.-R. Huang and S.-T. Wu, Mater. Chem. Phys., 92, 146 (2005).
- O.R.M. Khalifa, E. Abd El-Wahab and A.H. Tilp, Aust. J. Basic Appl. Sci., 5, 136 (2011).
- A. Sohrabi, A. Dolati, M. Ghorbani, M.R. Barati and P. Stroeve, J. Phys. Chem.C, 116, 4105 (2012).
References
J.Q. Zhang, M.Z. An, L.M. Chang and G.Y. Liu, Electrochim. Acta, 53, 2637 (2008).
K. Vathsala and T.V. Venkatesha, Appl. Surf. Sci., 257, 8929 (2011).
H.Y. Zheng and M.Z. An, J. Alloy. Comp., 459, 548 (2008).
Y.J. Xue, J.S. Li, W. Ma and M.-D. Duan, J. Mater. Sci., 41, 1781 (2006).
C. Zanella, M. Lekka and P.L. Bonora, Surf. Eng., 26, 511 (2010).
H.K. Lee, H.Y. Lee and J.M. Jeon, Met. Mater. Int., 14, 599 (2008).
H. Li, Y.Z. Wan, H. Liang, X.L. Li, Y. Huang and F. He, Appl. Surf. Sci., 256, 1614 (2009).
F.Y. Hou, W. Wang and H.T. Guo, Appl. Surf. Sci., 252, 3812 (2006).
M.-C. Chou, M.-D. Ger, S.-T. Ke, Y.-R. Huang and S.-T. Wu, Mater. Chem. Phys., 92, 146 (2005).
O.R.M. Khalifa, E. Abd El-Wahab and A.H. Tilp, Aust. J. Basic Appl. Sci., 5, 136 (2011).
A. Sohrabi, A. Dolati, M. Ghorbani, M.R. Barati and P. Stroeve, J. Phys. Chem.C, 116, 4105 (2012).