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Vol. 28 No. 5 (2016): Vol 28 Issue 5

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Effect of Some Organic Compounds on Electrodeposition of Copper Metal in Copper Cathode

https://doi.org/10.14233/ajchem.2016.19450
Mervette El-Batouti
Chemistry Department, Faculty of Science, Alexandria University, Alexandria, Egypt
Soad H. Salaam
Chemistry Department, Faculty of Science, Alexandria University, Alexandria, Egypt
Abdel-Moneim M. Ahmed
Chemistry Department, Faculty of Science, Alexandria University, Alexandria, Egypt

Corresponding Author(s) : Mervette El-Batouti

mervette_b@yahoo.com

Asian Journal of Chemistry, Vol. 28 No. 5 (2016): Vol 28 Issue 5

Abstract

In this article, copper electrodeposition in the presence of various types of organic compounds was studied. The effects of operating variables, including organic additives concentrations and temperature on the limiting current were investigated by the potentio-dynamic polarization technique. The adsorption of all inhibitors on copper cathode was found to obey Temkin, Flory-Huggin and kinetic adsorption isotherm. The calculated free energy of adsorption (DGads.) of inhibitor on copper surface indicated that the adsorption reactions were spontaneous (DGads. < 0). The thermodynamic activation parameters (Ea, DH*, DS* and DG*) were also estimated. It was found that activation energy values for copper electrodeposition in inhibited solutions were higher than that for uninhibited solution. The high inhibitor efficiency was discussed in terms of strong adsorption of inhibitor molecules on the copper surface.

Keywords

Electrodeposition Corrosion inhibition Thermodynamic parameters Organic additives
El-Batouti, M., Salaam, S. H., & Ahmed, A.-M. M. (2016). Effect of Some Organic Compounds on Electrodeposition of Copper Metal in Copper Cathode. Asian Journal of Chemistry, 28(5), 965–970. https://doi.org/10.14233/ajchem.2016.19450
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