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Vol. 25 No. 3 (2013): Vol 25 Issue 3

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Copper Electropolishing in the Presence of Purine Derivatives

https://doi.org/10.14233/ajchem.2013.13125
A.M. Ahmed
Department of Chemistry, Faculty of Science, Alexandria University, Alexandria, Egypt
S.M. Abd El-Haleem
Department of Chemistry, Faculty of Science, Zagazig University, Zagazig, Egypt
M.G.A. Saleh
Department of Chemistry, Faculty of Science, Zagazig University, Zagazig, Egypt
A.A.-H. Abdel-Rahman
Department of Chemistry, Faculty of Science, Menoufia. University, Shebin El-Koam, Egypt

Corresponding Author(s) : A.A.-H. Abdel-Rahman

adelnassar63@yahoo.com

Asian Journal of Chemistry, Vol. 25 No. 3 (2013): Vol 25 Issue 3

Abstract

The electropolishing settings for inhibiting the rate of anodic corrosion of copper plates in phosphoric acid were achieved using potentiodynamic studies including different factors such as plate height, phosphoric acid concentration, type and concentration of purines as well as temperature. The results reveal that purines have strongest inhibitive effect ranging from 9.7 to 80.1 % that provides good protection to copper surface against corrosion in phosphoric acid solutions. Its adsorption obeys Langmuir, Flory-Huggins and kinetic adsorption isotherm. Thermodynamic functions computed and discussed.

Keywords

Anodic corrosion Purine derivatives Adsorption isotherm Thermodynamic functions
Ahmed, A., Abd El-Haleem, S., Saleh, M., & Abdel-Rahman, A.-H. (2012). Copper Electropolishing in the Presence of Purine Derivatives. Asian Journal of Chemistry, 25(3), 1512–1520. https://doi.org/10.14233/ajchem.2013.13125
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