Copyright (c) 2024 Parameswaran P Subramanian, Professor(Dr). Lity Allen Varghese, Dr. Rethikala P.K.
This work is licensed under a Creative Commons Attribution 4.0 International License.
A Epoxidized Novolac Modification in Resol Phenolic under Open Mold Heat Curing for Microvoid Reduction
Corresponding Author(s) : Parameswaran P. Subramanian
Asian Journal of Chemistry,
Vol. 36 No. 9 (2024): Vol 36 Issue 9, 2024
Abstract
Resol phenolics were generally cured by temperature assisted compression molding. In this study, resol phenolic was modified using epoxidized novalacs (EN) and cured by heat assistance without pressure to find the influence of EN on the reduction of microvoids in cured resol phenolics. Epoxidized phenolic novolac (EPN), epoxidized p-cresol novolac (EPCN) and epoxidized o-cresol novolac (EOCN) were synthesized and used for modification of resols. The modification led to reduction in both the size and number of voids and increase in the tensile strength, flexural strength and impact strength of the resol phenolics. Epoxidized novolacs with phenol: formaldehyde ratios 1:0.7 and 1:0.9 exhibit comparatively better results for the resols. The decrease in the % soluble matter in the cured resin and FTIR spectrum show the incorporation of epoxidized novolacs to the resol phenolics. The dynamic mechanical analysis (DMA) confirms better damping properties of the modified resols. Thermogravimetric analysis shows improved thermal properties for the resol samples modified with EPN and EPCN. The optimum amount of epoxidies novolacs required for the modification was ~7.5-10%.
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References
A. Knop and W. Scheib, Chemistry and Application of Phenolic Resins, Springer-Verlag, Berlin Heidelberg, New York (1979).
L. Pilato, Phenolic Resins, A Century of Progress, Springer Berlin, Heidelberg (2010).
S.F. Hamad, N. Farr, T. Fei, N.F. Shukor, J.S. Dean, S.A. Hayes, J.P. Foreman and C. Rodenburg, J. Appl. Polym. Sci., 136, 48249 (2019); https://doi.org/10.1002/app.48249
H.-L. Yu, Y.-C. Gao, B. Qin, Z.-Y. Ma and S.-H. Yu, Acc. Mater. Res., 5, 146 (2024); https://doi.org/10.1021/accountsmr.3c00194
M. Patel, M. Yadav and M. Raj, Oriental J. Chem., 39, 867 (2023); https://doi.org/10.13005/ojc/390407
H. Kimura, M. Yonekawa, T. Shimokawaji, Y. Ohashi, E. Takata and T. Yamada, Polym. Adv. Technol., 35, 6432 (2024); https://doi.org/10.1002/pat.6432
P.S. Parameswaran, M.G. Bhuvaneswary and E.T. Thachil, J. Appl. Polym. Sci., 113, 802 (2009); https://doi.org/10.1002/app.29667
K.P. Singh and G.R. Palmese, J. Appl. Polym. Sci., 91, 3096 (2004); https://doi.org/10.1002/app.13439
J. Wolfrum and G. Ehrenstein, J. Appl. Polym. Sci., 74, 3173 (1999); https://doi.org/10.1002/(SICI)1097-4628
A. Moualhi, A.R. de Anda, H. Vahabi, S. Chatti, H. Abderrazak and E. Renard, Sustainable Chem. Eng., 11, 10293 (2023); https://doi.org/10.1021/acssuschemeng.3c00916
M.P. Raghav Rao, T.D. Urmode and V.S. Shinde, Mater. Res. Expr., 6, 115329 (2019); https://doi.org/10.1088/2053-1591/ab49da
K. Tang, A. Zhang, T. Ge, X. Liu, X. Tang and Y. Li, Mater. Today Commun., 26, 101879 (2019); https://doi.org/10.1016/j.mtcomm.2020.101879
Y. Hu, W. Geng, H. You, Y. Wang and D.A. Loy, Polymers, 6, 105 (2014); https://doi.org/10.3390/polym6010105
K.P. Unnikrishnan and E.T. Thachil, Polym.-Plast. Technol. Eng., 45, 469 (2006); https://doi.org/10.1080/03602550600553762
M.C. Cabo Jr., M.N. Prabhakar and J.-I. Song, Ind. Eng. Chem. Res., 62, 7962 (2023); https://doi.org/10.1021/acs.iecr.3c00822
A.B. Cherian and E.T. Thachil, J. Appl. Polym. Sci., 100, 457 (2006); https://doi.org/10.1002/app.23132
S. Maji, O. Urakawa and T. Inoue, Polym. J., 46, 584 (2014); https://doi.org/10.1038/pj.2014.27
T. Johnson and S. Thomas, Polym.-Plast. Technol. Eng., 39, 363 (2000); https://doi.org/10.1081/PPT-100100035
S.C. Kim, M.B. Ko and W.H. Jo, Polymer, 36, 2189 (1995); https://doi.org/10.1016/0032-3861(95)95295-C
A.W. Coats and J.P. Redfern, Nature, 201, 68 (1964); https://doi.org/10.1038/201068a0