Copyright (c) 2015 AJC
This work is licensed under a Creative Commons Attribution 4.0 International License.
Influence of Vitamin C on Copper Electrorefining from Acidic Solution of Copper Sulfate
Corresponding Author(s) : F.M. Abouzeid
Asian Journal of Chemistry,
Vol. 27 No. 12 (2015): Vol 27 Issue 12
Abstract
Electrorefining of copper in the presence of vitamin C was studied using potentiodynamic polarization method. The effect of operating conditions including sulphuric acid concentration, temperature and vitamin C concentration on limiting current. The results show that Cu deposit from its acidic solution of copper sulfate and rate of deposition decrease with increasing the concentration of suphuric acid. Vitamin C is a suppresser with the strongest action on copper electrodeposition and inhibition efficiencyincreased by increasing vitamin C concentration. The activated parameters were estimated and discussed. The adsorption of vitamin C on cathode copper surface in the acid solution was found to obey Kinetic-thermodynamic adsorption isotherm. The influence of vitamin C on morphology of electrodeposited powder was studied. Addition of vitamin C to copper bath exhibits a strong influence on the microstructure (refining the deposit).
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- M.A. Pasquale, L.M. Gassa and A.J. Arvia, Electrochim. Acta, 53, 5891 (2008); doi:10.1016/j.electacta.2008.03.073.
- L.D. Burke and R. Sharna, J. Electrochem. Soc., 155, 285 (2008); doi:10.1149/1.2837824.
- M.S. Kang, S.-K. Kim, K. Kim and J.J. Kim, Thin Solid Films, 516, 3761 (2008); doi:10.1016/j.tsf.2007.06.069.
- D.R. Turner and G.R. Johnson, J. Electrochem. Soc., 109, 798 (1962); doi:10.1149/1.2425558.
- B. Bozzini, L. D’Urzo and C. Mele, Electrochim. Acta, 52, 4767 (2007); doi:10.1016/j.electacta.2007.01.015.
- A.L. Portela, M.L. Teijelo and G.I. Lacconi, Electrochim. Acta, 51, 3261 (2006); doi:10.1016/j.electacta.2005.09.029.
- C. Firoiu, Tehnologia Proceselor Electrochimice, Ed. Didactica si Pedagogica, Bucuresti (1983).
- N. Ibl and K. Schadegg, J. Electrochem. Soc., 114, 1268 (1967); doi:10.1149/1.2426474.
- C.C .Vaduva, N .Vaszilcsin and A. Kellenberger, The Annals of Dunarea de Jos University, Fascicle IX, Metallurgy and Mineral Science, pp. 180-187 (2011).
- A. Milchev and T. Zapryanova, Electrochim. Acta, 51, 2926 (2006); doi:10.1016/j.electacta.2005.08.045.
- C.C. Vaduva, N. Vaszilcsin, A. Kellenberger and M. Medeleanu, Int. J. Hydrogen Energy, 36, 6994 (2011); doi:10.1016/j.ijhydene.2011.03.076.
- C.C. Vaduva, C.N. Vaszilcsin and A. Kellenberger, Corros. Anticorros. Protect., 6, 23 (2011).
- C.C. Vaduva, C.N. Vaszilcsin, A. Kellenberger and B.I. Pancan, Corros. Anticorros. Protect, 6, 19 (2011).
- O.L. Blajiev, T. Breugelmans, R. Pintelon, H. Terryn and A. Hubin, Electrochim. Acta, 53, 7451 (2008); doi:10.1016/j.electacta.2008.01.048.
- L. Gavrila, Fenomene de Transfer, Alma Mater, Bacau, vol. II (2000).
- H.H. Abdel-Rahman, A.M. Ahmed, A.A. Harfoush and A.H.E. Moustafa, Hydrometallurgy, 104, 169 (2010); doi:10.1016/j.hydromet.2010.05.015.
- J. Mendham, R.C. Denney and M.B. Thomas, Vogel's Quantitative Chemical Analysis, edn 6 (2004).
- B.F. Rothschild, Plating Surf. Finish., 66, 70 (1979).
- Y. Fukunaka, H. Doi, Y. Nakamura and Y. Kondo, in eds.: L.T. Romankiw and T. Osaka, Electrochemical Technology in Electronics, Electrochemical Society, Pennington, NJ, Vol. 88-23, p. 83 (1988).
- W.D. Barba and T. Hurlen, J. Electroanal. Chem., 91, 359 (1978); doi:10.1016/S0022-0728(78)80286-1.
- K. Denpo, T. Okumara, Y. Fukunaka and Y. Kondo, J. Electrochem. Soc., 132, 1145 (1985); doi:10.1149/1.2114030.
- A.A.J. Taha, Colloids Interf. Sci., 275, 235 (2004); doi:10.1016/j.jcis.2004.01.031.
- A. Gomes and M.I. da Silva Pereira, Electrochim. Acta, 52, 863 (2006); doi:10.1016/j.electacta.2006.06.025.
- A.M. Abdel-Gaber, B.A. Abd-El-Nabey, I.M. Sidahmed, A.M. El-Zayady and M. Saadawy, Corros. Sci., 48, 2765 (2006); doi:10.1016/j.corsci.2005.09.017.
- W. Plieth, Electrochim. Acta, 37, 2115 (1992); doi:10.1016/0013-4686(92)85101-P.
- J.D. Reid and A.P. David, Plating Surf. Finish., 74, 66 (1987).
- L. Mirkova, St. Rashkov and C. Nanev, Surf. Technol., 15, 181 (1985); doi:10.1016/0376-4583(85)90060-3.
- M. Hill and G.T. Rogers, J. Electroanal. Chem., 86, 179 (1978); doi:10.1016/S0022-0728(78)80365-9.
- A. Vicenzo and P.L. Cavallotti, J. Appl. Electrochem., 32, 743 (2002); doi:10.1023/A:1020191111298.
- N.D. Nikolic, L.J. Pavlovic, M.G. Pavlovic and K. Popov, J. Serb. Chem. Soc., 72, 1369 (2007); doi:10.2298/JSC0712369N.
- A. Amadi, D.R. Gabe and M. Goodenough, J. Appl. Electrochem., 21, 1114 (1991); doi:10.1007/BF01041457.
- H. Vogt and R.J. Balzer, Electrochim. Acta, 50, 2073 (2005); doi:10.1016/j.electacta.2004.09.025.
- A.M. Al-Sabagh, H.M. Abd-El-Bary, R.A. El-Ghazawy, M.R. Mishrif and B.M. Hussein, Egypt. J. Petrol., 20, 33 (2011); doi:10.1016/j.ejpe.2011.06.010.
- M.A. Deyab, Corros. Sci., 49, 2315 (2007); doi:10.1016/j.corsci.2006.10.035.
- M. Bouklah, N. Benchat, A. Aouniti, B. Hammouti, M. Benkaddour, M. Lagre’nee, H. Vezin and F. Bentiss, Prog. Org. Coat., 51, 118 (2004); doi:10.1016/j.porgcoat.2004.06.005.
- F. Kellou-Kerkouche, A. Benchettara and S. Amara, Mater. Chem. Phys., 110, 26 (2008); doi:10.1016/j.matchemphys.2008.01.005.
- S.S. Al-Juaid, Portug. Electrochim. Acta, 25, 363 (2007); doi:10.4152/pea.200703363.
- Z. Tao, S. Zhang, W. Li and B. Hou, Corros. Sci., 51, 2588 (2009); doi:10.1016/j.corsci.2009.06.042.
- O.L. Riggs Jr, Corrosion Inhibitors, in ed.: C.C. Nathan, NACE, Houston, TX, edn 2 (1973).
- A. Hamdy and N.S. El-Gendy, Egypt. J. Petrol., 22, 17 (2013); doi:10.1016/j.ejpe.2012.06.002.
- I. Langmuir, J. Am. Chem. Soc., 40, 1361 (1918); doi:10.1021/ja02242a004.
- D. Prabhu and P. Rao, J. Environ. Chem. Eng., 1, 676 (2013); doi:10.1016/j.jece.2013.07.004.
- A.A. El-Awady, B.A. Abd-El-Nabey and S.G. Aziz, J. Electrochem. Soc., 139, 2149 (1992); doi:10.1149/1.2221193.
- I.E. Uwah, P.C. Okafor and V.E. Ebiekpe, Arabian J. Chem., 6, 285 (2013); doi:10.1016/j.arabjc.2010.10.008.
- A.R.S. Priya, V.S. Muralidharam and A. Subranania, Corrosion, 64, 541 (2008); doi:10.5006/1.3278490.
References
M.A. Pasquale, L.M. Gassa and A.J. Arvia, Electrochim. Acta, 53, 5891 (2008); doi:10.1016/j.electacta.2008.03.073.
L.D. Burke and R. Sharna, J. Electrochem. Soc., 155, 285 (2008); doi:10.1149/1.2837824.
M.S. Kang, S.-K. Kim, K. Kim and J.J. Kim, Thin Solid Films, 516, 3761 (2008); doi:10.1016/j.tsf.2007.06.069.
D.R. Turner and G.R. Johnson, J. Electrochem. Soc., 109, 798 (1962); doi:10.1149/1.2425558.
B. Bozzini, L. D’Urzo and C. Mele, Electrochim. Acta, 52, 4767 (2007); doi:10.1016/j.electacta.2007.01.015.
A.L. Portela, M.L. Teijelo and G.I. Lacconi, Electrochim. Acta, 51, 3261 (2006); doi:10.1016/j.electacta.2005.09.029.
C. Firoiu, Tehnologia Proceselor Electrochimice, Ed. Didactica si Pedagogica, Bucuresti (1983).
N. Ibl and K. Schadegg, J. Electrochem. Soc., 114, 1268 (1967); doi:10.1149/1.2426474.
C.C .Vaduva, N .Vaszilcsin and A. Kellenberger, The Annals of Dunarea de Jos University, Fascicle IX, Metallurgy and Mineral Science, pp. 180-187 (2011).
A. Milchev and T. Zapryanova, Electrochim. Acta, 51, 2926 (2006); doi:10.1016/j.electacta.2005.08.045.
C.C. Vaduva, N. Vaszilcsin, A. Kellenberger and M. Medeleanu, Int. J. Hydrogen Energy, 36, 6994 (2011); doi:10.1016/j.ijhydene.2011.03.076.
C.C. Vaduva, C.N. Vaszilcsin and A. Kellenberger, Corros. Anticorros. Protect., 6, 23 (2011).
C.C. Vaduva, C.N. Vaszilcsin, A. Kellenberger and B.I. Pancan, Corros. Anticorros. Protect, 6, 19 (2011).
O.L. Blajiev, T. Breugelmans, R. Pintelon, H. Terryn and A. Hubin, Electrochim. Acta, 53, 7451 (2008); doi:10.1016/j.electacta.2008.01.048.
L. Gavrila, Fenomene de Transfer, Alma Mater, Bacau, vol. II (2000).
H.H. Abdel-Rahman, A.M. Ahmed, A.A. Harfoush and A.H.E. Moustafa, Hydrometallurgy, 104, 169 (2010); doi:10.1016/j.hydromet.2010.05.015.
J. Mendham, R.C. Denney and M.B. Thomas, Vogel's Quantitative Chemical Analysis, edn 6 (2004).
B.F. Rothschild, Plating Surf. Finish., 66, 70 (1979).
Y. Fukunaka, H. Doi, Y. Nakamura and Y. Kondo, in eds.: L.T. Romankiw and T. Osaka, Electrochemical Technology in Electronics, Electrochemical Society, Pennington, NJ, Vol. 88-23, p. 83 (1988).
W.D. Barba and T. Hurlen, J. Electroanal. Chem., 91, 359 (1978); doi:10.1016/S0022-0728(78)80286-1.
K. Denpo, T. Okumara, Y. Fukunaka and Y. Kondo, J. Electrochem. Soc., 132, 1145 (1985); doi:10.1149/1.2114030.
A.A.J. Taha, Colloids Interf. Sci., 275, 235 (2004); doi:10.1016/j.jcis.2004.01.031.
A. Gomes and M.I. da Silva Pereira, Electrochim. Acta, 52, 863 (2006); doi:10.1016/j.electacta.2006.06.025.
A.M. Abdel-Gaber, B.A. Abd-El-Nabey, I.M. Sidahmed, A.M. El-Zayady and M. Saadawy, Corros. Sci., 48, 2765 (2006); doi:10.1016/j.corsci.2005.09.017.
W. Plieth, Electrochim. Acta, 37, 2115 (1992); doi:10.1016/0013-4686(92)85101-P.
J.D. Reid and A.P. David, Plating Surf. Finish., 74, 66 (1987).
L. Mirkova, St. Rashkov and C. Nanev, Surf. Technol., 15, 181 (1985); doi:10.1016/0376-4583(85)90060-3.
M. Hill and G.T. Rogers, J. Electroanal. Chem., 86, 179 (1978); doi:10.1016/S0022-0728(78)80365-9.
A. Vicenzo and P.L. Cavallotti, J. Appl. Electrochem., 32, 743 (2002); doi:10.1023/A:1020191111298.
N.D. Nikolic, L.J. Pavlovic, M.G. Pavlovic and K. Popov, J. Serb. Chem. Soc., 72, 1369 (2007); doi:10.2298/JSC0712369N.
A. Amadi, D.R. Gabe and M. Goodenough, J. Appl. Electrochem., 21, 1114 (1991); doi:10.1007/BF01041457.
H. Vogt and R.J. Balzer, Electrochim. Acta, 50, 2073 (2005); doi:10.1016/j.electacta.2004.09.025.
A.M. Al-Sabagh, H.M. Abd-El-Bary, R.A. El-Ghazawy, M.R. Mishrif and B.M. Hussein, Egypt. J. Petrol., 20, 33 (2011); doi:10.1016/j.ejpe.2011.06.010.
M.A. Deyab, Corros. Sci., 49, 2315 (2007); doi:10.1016/j.corsci.2006.10.035.
M. Bouklah, N. Benchat, A. Aouniti, B. Hammouti, M. Benkaddour, M. Lagre’nee, H. Vezin and F. Bentiss, Prog. Org. Coat., 51, 118 (2004); doi:10.1016/j.porgcoat.2004.06.005.
F. Kellou-Kerkouche, A. Benchettara and S. Amara, Mater. Chem. Phys., 110, 26 (2008); doi:10.1016/j.matchemphys.2008.01.005.
S.S. Al-Juaid, Portug. Electrochim. Acta, 25, 363 (2007); doi:10.4152/pea.200703363.
Z. Tao, S. Zhang, W. Li and B. Hou, Corros. Sci., 51, 2588 (2009); doi:10.1016/j.corsci.2009.06.042.
O.L. Riggs Jr, Corrosion Inhibitors, in ed.: C.C. Nathan, NACE, Houston, TX, edn 2 (1973).
A. Hamdy and N.S. El-Gendy, Egypt. J. Petrol., 22, 17 (2013); doi:10.1016/j.ejpe.2012.06.002.
I. Langmuir, J. Am. Chem. Soc., 40, 1361 (1918); doi:10.1021/ja02242a004.
D. Prabhu and P. Rao, J. Environ. Chem. Eng., 1, 676 (2013); doi:10.1016/j.jece.2013.07.004.
A.A. El-Awady, B.A. Abd-El-Nabey and S.G. Aziz, J. Electrochem. Soc., 139, 2149 (1992); doi:10.1149/1.2221193.
I.E. Uwah, P.C. Okafor and V.E. Ebiekpe, Arabian J. Chem., 6, 285 (2013); doi:10.1016/j.arabjc.2010.10.008.
A.R.S. Priya, V.S. Muralidharam and A. Subranania, Corrosion, 64, 541 (2008); doi:10.5006/1.3278490.