Copyright (c) 2014 AJC
This work is licensed under a Creative Commons Attribution 4.0 International License.
Preparation of Amorphous Coatings of AlFeCoNiCuZrV Alloy by Direct Current Magnetron Sputtering Method
Corresponding Author(s) : J.C. Li
Asian Journal of Chemistry,
Vol. 26 No. 17 (2014): Vol 26 Issue 17
Abstract
The amorphous coatings of AlFeCoNiCuZrV high entropy alloy were deposited by direct current magnetron sputtering (DCMS) in the mixed atmosphere of Ar and O2. A smooth amorphous coating was obtained. The microstructure and properties of the coatings were investigated. The results showed that the chemical composition, microstructure and mechanical properties of the amorphous coatings intimately relied on the concentration of O2 in the mixture atmosphere. When O2 flow ratio increased, the thickness and roughness of the coatings decreased. The maximum values of the hardness and the elastic modulus of the coating are 12 and 168 Gpa, respectively.
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- J.W. Yeh, S.K. Chen, S.J. Lin, J.Y. Gan, T.S. Chin, T.T. Shun, C.-H. Tsau and S.-Y. Chang, Adv. Eng. Mater., 6, 299 (2004); doi:10.1002/adem.200300567.
- P.-K. Huang, J.-W. Yeh, T.-T. Shun and S.-K. Chen, Adv. Eng. Mater., 6, 74 (2004); doi:10.1002/adem.200300507.
- S.C. Liang, D.C. Tsai, Z.C. Chang, H.S. Sung, Y.C. Lin, J.W. Yeh, M.J. Deng and F.S. Shieu, Appl. Surf. Sci., 258, 399 (2011); doi:10.1016/j.apsusc.2011.09.006.
- K.H. Cheng, C.H. Lai, S.J. Lin and J.W. Yeh, Thin Solid Films, 519, 3185 (2011); doi:10.1016/j.tsf.2010.11.034.
- S.C. Liang, Z.C. Chang, D.C. Tsai, Y.-C. Lin, H.S. Sung, M.J. Deng and F.S. Shieu, Appl. Surf. Sci., 257, 7709 (2011); doi:10.1016/j.apsusc.2011.04.014.
- M.H. Tsai, J.W. Yeh and J.Y. Gan, Thin Solid Films, 516, 5527 (2008); doi:10.1016/j.tsf.2007.07.109.
- T.K. Chen, T.T. Shun, J.W. Yeh and M.S. Wong, Surf. Coat. Technol., 188-189, 193 (2004); doi:10.1016/j.surfcoat.2004.08.023.
- S.Y. Chang and D.S. Chen, Mater. Chem. Phys., 125, 5 (2011); doi:10.1016/j.matchemphys.2010.09.016.
- Y.Y. Chen, T. Duval, U.D. Hung, J.W. Yeh and H.C. Shih, Corros. Sci., 47, 2257 (2005); doi:10.1016/j.corsci.2004.11.008.
- H.K. Chen, S.H. Li and J.G. Duh, J. Electron. Mater., 34, 1480 (2005); doi:10.1007/s11664-005-0154-x.
- Y.J. Zhou, Y. Zhang, Y.L. Wang and G.L. Chen, Mater. Sci. Eng. A, 454-455, 260 (2007); doi:10.1016/j.msea.2006.11.049.
- Y.J. Zhou, Y. Zhang, Y.L. Wang and G.L. Chen, Appl. Phys. Lett., 90, 181904 (2007); doi:10.1063/1.2734517.
- Z. Hu, Y. Zhan, G. Zhang, J. She and C. Li, Mater. Des., 31, 1599 (2010); doi:10.1016/j.matdes.2009.09.016.
- C.-Y. Hsu, T.-S. Sheu, J.-W. Yeh and S.-K. Chen, Wear, 268, 653 (2010); doi:10.1016/j.wear.2009.10.013.
- C. Huang, Y.Z. Zhang, R. Vilar and J.Y. Shen, Mater. Des., 41, 338 (2012); doi:10.1016/j.matdes.2012.04.049.
- B. Ren, Z.X. Liu, B. Cai, M.X. Wang and L. Shi, Mater. Des., 33, 121 (2012); doi:10.1016/j.matdes.2011.07.005.
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- N. Senkov, G.B. Wilks, D.B. Miracle, C.P. Chuang and P.K. Liaw, Intermetallics, 18, 1758 (2010); doi:10.1016/j.intermet.2010.05.014.
- J. Musil, P. Karvánková and J. Kasl, Surf. Coat. Technol., 139, 101 (2001); doi:10.1016/S0257-8972(01)00989-6.
- M. Uchida, N. Nihira, A. Mitsuo, K. Toyoda, K. Kubota and T. Aizawa, Surf. Coat. Technol., 177-178, 627 (2004); doi:10.1016/S0257-8972(03)00937-X.
- C.W. Kim and K.H. Kim, Thin Solid Films, 307, 113 (1997); doi:10.1016/S0040-6090(97)00212-5.
- C.H. Lai, S.J. Lin, J.W. Yeh and S.Y. Chang, Surf. Coat. Technol., 201, 3275 (2006); doi:10.1016/j.surfcoat.2006.06.048.
- C.W. Tsai, S.W. Lai, K.H. Cheng, M.H. Tsai, A. Davison, C.H. Tsau and J.W. Yeh, Thin Solid Films, 520, 2613 (2012); doi:10.1016/j.tsf.2011.11.025.
- L. Liu, J.B. Zhu, C. Hou, J.-C. Li and Q. Jiang, Mater. Des., 46, 675 (2013); doi:10.1016/j.matdes.2012.11.001.
- H.W. Chang, P.K. Huang, A. Davison, J.W. Yeh, C.-H. Tsau and C.-C. Yang, Thin Solid Films, 516, 6402 (2008); doi:10.1016/j.tsf.2008.01.019.
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- M.I. Lin, M.H. Tsai, W.J. Shen and J.W. Yeh, Thin Solid Films, 518, 2732 (2010); doi:10.1016/j.tsf.2009.10.142.
- A. Inoue, Mater. Trans. JIM, 36, 866 (1995); doi:10.2320/matertrans1989.36.866.
- H.O. Pierson, Handbook of Refractory Carbides and Nitrides, Noyes Publications, Westwood, New Jersey, P. 43 (1996).
- J.A. Dean, Lange's Handbook of Chemistry, McGraw-Hill, New York, p. 234 (1999).
- R.S. Mason and M. Pichilingi, J. Phys. D Appl. Phys., 27, 2363 (1994); doi:10.1088/0022-3727/27/11/017.
- B.N. Chapman, Glow Discharge Processes, John Wiley & Sons, New York, p. 230 (1980).
- J.A. Thornton, J. Vac. Sci. Technol. A, 4, 3059 (1986); doi:10.1116/1.573628.
- R. Messier, V.C. Venugopal and P.D. Sunal, J. Vac. Sci. Technol. A, 18, 1538 (2000); doi:10.1116/1.582381.
- C.Z. Yao, P. Zhang, M. Liu, G.R. Li, J.Q. Ye, P. Liu and Y.-X. Tong, Electrochim. Acta, 53, 8359 (2008); doi:10.1016/j.electacta.2008.06.036.
- M.H. Tsai, C.W. Wang, C.H. Lai, J.W. Yeh and J.Y. Gan, Appl. Phys. Lett., 92, 052109 (2008); doi:10.1063/1.2841810.
References
J.W. Yeh, S.K. Chen, S.J. Lin, J.Y. Gan, T.S. Chin, T.T. Shun, C.-H. Tsau and S.-Y. Chang, Adv. Eng. Mater., 6, 299 (2004); doi:10.1002/adem.200300567.
P.-K. Huang, J.-W. Yeh, T.-T. Shun and S.-K. Chen, Adv. Eng. Mater., 6, 74 (2004); doi:10.1002/adem.200300507.
S.C. Liang, D.C. Tsai, Z.C. Chang, H.S. Sung, Y.C. Lin, J.W. Yeh, M.J. Deng and F.S. Shieu, Appl. Surf. Sci., 258, 399 (2011); doi:10.1016/j.apsusc.2011.09.006.
K.H. Cheng, C.H. Lai, S.J. Lin and J.W. Yeh, Thin Solid Films, 519, 3185 (2011); doi:10.1016/j.tsf.2010.11.034.
S.C. Liang, Z.C. Chang, D.C. Tsai, Y.-C. Lin, H.S. Sung, M.J. Deng and F.S. Shieu, Appl. Surf. Sci., 257, 7709 (2011); doi:10.1016/j.apsusc.2011.04.014.
M.H. Tsai, J.W. Yeh and J.Y. Gan, Thin Solid Films, 516, 5527 (2008); doi:10.1016/j.tsf.2007.07.109.
T.K. Chen, T.T. Shun, J.W. Yeh and M.S. Wong, Surf. Coat. Technol., 188-189, 193 (2004); doi:10.1016/j.surfcoat.2004.08.023.
S.Y. Chang and D.S. Chen, Mater. Chem. Phys., 125, 5 (2011); doi:10.1016/j.matchemphys.2010.09.016.
Y.Y. Chen, T. Duval, U.D. Hung, J.W. Yeh and H.C. Shih, Corros. Sci., 47, 2257 (2005); doi:10.1016/j.corsci.2004.11.008.
H.K. Chen, S.H. Li and J.G. Duh, J. Electron. Mater., 34, 1480 (2005); doi:10.1007/s11664-005-0154-x.
Y.J. Zhou, Y. Zhang, Y.L. Wang and G.L. Chen, Mater. Sci. Eng. A, 454-455, 260 (2007); doi:10.1016/j.msea.2006.11.049.
Y.J. Zhou, Y. Zhang, Y.L. Wang and G.L. Chen, Appl. Phys. Lett., 90, 181904 (2007); doi:10.1063/1.2734517.
Z. Hu, Y. Zhan, G. Zhang, J. She and C. Li, Mater. Des., 31, 1599 (2010); doi:10.1016/j.matdes.2009.09.016.
C.-Y. Hsu, T.-S. Sheu, J.-W. Yeh and S.-K. Chen, Wear, 268, 653 (2010); doi:10.1016/j.wear.2009.10.013.
C. Huang, Y.Z. Zhang, R. Vilar and J.Y. Shen, Mater. Des., 41, 338 (2012); doi:10.1016/j.matdes.2012.04.049.
B. Ren, Z.X. Liu, B. Cai, M.X. Wang and L. Shi, Mater. Des., 33, 121 (2012); doi:10.1016/j.matdes.2011.07.005.
C.W. Tsai, Y.L. Chen, M.H. Tsai, J.W. Yeh, T.T. Shun and S.-K. Chen, J. Alloys Comp., 486, 427 (2009); doi:10.1016/j.jallcom.2009.06.182.
N. Senkov, G.B. Wilks, D.B. Miracle, C.P. Chuang and P.K. Liaw, Intermetallics, 18, 1758 (2010); doi:10.1016/j.intermet.2010.05.014.
J. Musil, P. Karvánková and J. Kasl, Surf. Coat. Technol., 139, 101 (2001); doi:10.1016/S0257-8972(01)00989-6.
M. Uchida, N. Nihira, A. Mitsuo, K. Toyoda, K. Kubota and T. Aizawa, Surf. Coat. Technol., 177-178, 627 (2004); doi:10.1016/S0257-8972(03)00937-X.
C.W. Kim and K.H. Kim, Thin Solid Films, 307, 113 (1997); doi:10.1016/S0040-6090(97)00212-5.
C.H. Lai, S.J. Lin, J.W. Yeh and S.Y. Chang, Surf. Coat. Technol., 201, 3275 (2006); doi:10.1016/j.surfcoat.2006.06.048.
C.W. Tsai, S.W. Lai, K.H. Cheng, M.H. Tsai, A. Davison, C.H. Tsau and J.W. Yeh, Thin Solid Films, 520, 2613 (2012); doi:10.1016/j.tsf.2011.11.025.
L. Liu, J.B. Zhu, C. Hou, J.-C. Li and Q. Jiang, Mater. Des., 46, 675 (2013); doi:10.1016/j.matdes.2012.11.001.
H.W. Chang, P.K. Huang, A. Davison, J.W. Yeh, C.-H. Tsau and C.-C. Yang, Thin Solid Films, 516, 6402 (2008); doi:10.1016/j.tsf.2008.01.019.
Y.S. Huang, L. Chen, H.W. Lui, M.H. Cai and J.W. Yeh, Mater. Sci. Eng. A, 457, 77 (2007); doi:10.1016/j.msea.2006.12.001.
M.I. Lin, M.H. Tsai, W.J. Shen and J.W. Yeh, Thin Solid Films, 518, 2732 (2010); doi:10.1016/j.tsf.2009.10.142.
A. Inoue, Mater. Trans. JIM, 36, 866 (1995); doi:10.2320/matertrans1989.36.866.
H.O. Pierson, Handbook of Refractory Carbides and Nitrides, Noyes Publications, Westwood, New Jersey, P. 43 (1996).
J.A. Dean, Lange's Handbook of Chemistry, McGraw-Hill, New York, p. 234 (1999).
R.S. Mason and M. Pichilingi, J. Phys. D Appl. Phys., 27, 2363 (1994); doi:10.1088/0022-3727/27/11/017.
B.N. Chapman, Glow Discharge Processes, John Wiley & Sons, New York, p. 230 (1980).
J.A. Thornton, J. Vac. Sci. Technol. A, 4, 3059 (1986); doi:10.1116/1.573628.
R. Messier, V.C. Venugopal and P.D. Sunal, J. Vac. Sci. Technol. A, 18, 1538 (2000); doi:10.1116/1.582381.
C.Z. Yao, P. Zhang, M. Liu, G.R. Li, J.Q. Ye, P. Liu and Y.-X. Tong, Electrochim. Acta, 53, 8359 (2008); doi:10.1016/j.electacta.2008.06.036.
M.H. Tsai, C.W. Wang, C.H. Lai, J.W. Yeh and J.Y. Gan, Appl. Phys. Lett., 92, 052109 (2008); doi:10.1063/1.2841810.