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Novel Silica-Based Hybrid Adsorbents: Copper(II) Adsorption Isotherms and Thermodynamics
Corresponding Author(s) : Junsheng Liu
Asian Journal of Chemistry,
Vol. 26 No. 13 (2014): Vol 26 Issue 13
Abstract
In this study, copper(II) adsorption isotherms and thermodynamic data have been investigated using a hybrid membrane as an adsorbent. It is found that copper(II) adsorption on sample D followed the Freundlich isotherm model. Moreover, it is found that the adsorption capacity of copper(II) on sample D increases with an increase in solution temperature and the DG values are changed from positive to negative as the temperature increased, suggesting that copper(II) adsorption is an endothermic and spontaneous in nature as the solution temperature was elevated to higher level. In addition, based on intraparticle diffusion, it is confirmed that copper(II) adsorption is not governed by intraparticle diffusion and diffusion-controlled adsorption mechanism might be the major control process. This finding is meaningful in the removal of copper(II) from aqueous solution using hybrid membrane as an adsorbent.
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- J. Li, S.W. Zhang, C.L. Chen, G.X. Zhao, X. Yang, J.X. Li and X.K. Wang, ACS Appl. Mater. Interfaces, 4, 4991 (2012); doi:10.1021/am301358b.
- S.A. Ali, O.C.S. Al Hamouz and N.M. Hassan, J. Hazard. Mater., 248-249, 47 (2013); doi:10.1016/j.jhazmat.2012.12.052.
- M. Karatas, J. Hazard. Mater., 199–200, 383 (2012); doi:10.1016/j.jhazmat.2011.11.035.
- J.-J. Guo and W.-B. Chen, Asian J. Chem., 25, 3609 (2013); doi:10.14233/ajchem.2013.13677.
- E. Repo, J.K. Warchoł, A. Bhatnagar and M. Sillanpää, J. Colloid Interf. Sci., 358, 261 (2011); doi:10.1016/j.jcis.2011.02.059.
- G.P. Kumar, P.A. Kumar, S. Chakraborty and M. Ray, Sep. Purif. Technol., 57, 47 (2007); doi:10.1016/j.seppur.2007.03.003.
- Q. Dong, J.S. Liu, L. Song and G.Q. Shao, J. Hazard. Mater., 186, 1335 (2011); doi:10.1016/j.jhazmat.2010.12.012.
- X. Wang, W.X. Zhang, J.S. Liu and L.L. Wu, Asian J. Chem., 25, 6575 (2013); doi:10.14233/ajchem.2013.14369.
- K.Y. Hu, J.S. Liu and K.C. Wang, Asian J. Chem., 26, 2571 (2014); doi:10.14233/ajchem.2014.15733.
- A. Ramesh, H. Hasegawa, T. Maki and K. Ueda, Sep. Purif. Technol., 56, 90 (2007); doi:10.1016/j.seppur.2007.01.025.
- A.A. Atia, A.M. Donia and A.M. Yousif, Sep. Purif. Technol., 61, 348 (2008); doi:10.1016/j.seppur.2007.11.008.
- E. Guibal, C. Milot and J.M. Tobin, Ind. Eng. Chem. Res., 37, 1454 (1998); doi:10.1021/ie9703954.
- P.K. Chatterjee and A.K. Sengupta, AIChE J., 55, 2997 (2009); doi:10.1002/aic.11915.
References
J. Li, S.W. Zhang, C.L. Chen, G.X. Zhao, X. Yang, J.X. Li and X.K. Wang, ACS Appl. Mater. Interfaces, 4, 4991 (2012); doi:10.1021/am301358b.
S.A. Ali, O.C.S. Al Hamouz and N.M. Hassan, J. Hazard. Mater., 248-249, 47 (2013); doi:10.1016/j.jhazmat.2012.12.052.
M. Karatas, J. Hazard. Mater., 199–200, 383 (2012); doi:10.1016/j.jhazmat.2011.11.035.
J.-J. Guo and W.-B. Chen, Asian J. Chem., 25, 3609 (2013); doi:10.14233/ajchem.2013.13677.
E. Repo, J.K. Warchoł, A. Bhatnagar and M. Sillanpää, J. Colloid Interf. Sci., 358, 261 (2011); doi:10.1016/j.jcis.2011.02.059.
G.P. Kumar, P.A. Kumar, S. Chakraborty and M. Ray, Sep. Purif. Technol., 57, 47 (2007); doi:10.1016/j.seppur.2007.03.003.
Q. Dong, J.S. Liu, L. Song and G.Q. Shao, J. Hazard. Mater., 186, 1335 (2011); doi:10.1016/j.jhazmat.2010.12.012.
X. Wang, W.X. Zhang, J.S. Liu and L.L. Wu, Asian J. Chem., 25, 6575 (2013); doi:10.14233/ajchem.2013.14369.
K.Y. Hu, J.S. Liu and K.C. Wang, Asian J. Chem., 26, 2571 (2014); doi:10.14233/ajchem.2014.15733.
A. Ramesh, H. Hasegawa, T. Maki and K. Ueda, Sep. Purif. Technol., 56, 90 (2007); doi:10.1016/j.seppur.2007.01.025.
A.A. Atia, A.M. Donia and A.M. Yousif, Sep. Purif. Technol., 61, 348 (2008); doi:10.1016/j.seppur.2007.11.008.
E. Guibal, C. Milot and J.M. Tobin, Ind. Eng. Chem. Res., 37, 1454 (1998); doi:10.1021/ie9703954.
P.K. Chatterjee and A.K. Sengupta, AIChE J., 55, 2997 (2009); doi:10.1002/aic.11915.