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Effect of Anodic Mass Transfer in the Electrowinning of Copper in Presence of Organic Compounds
Corresponding Author(s) : Nabila M. El-Mallah
Asian Journal of Chemistry,
Vol. 25 No. 3 (2013): Vol 25 Issue 3
Abstract
The effect of anodic oxygen bubbles on the rate of mass transfer was studied by measuring the limiting current of deposition of copper from acidified CuSO4 solution using parallel plate cell. Different factors studied as types of inhibitors, their concentrations and temperatures. The organic additives used are glucose, fructose, mannose, sucrose, lactose and maltose. The rate of mass transfer was found to decrease over the natural convection value by an amount ranging from 1.8-32.3 % depending on the types of additives and its concentration. Thermodynamic parameters Ea, DH*, DS*, DG* were evaluated and discussed. The adsorption of organic additives was found to obey Langmuir, Temkin, Flory-Huggin and kinetic adsorption isotherm.
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References
N. Ibl, P. Delahary and C.W. Tobias, Advances in Electrochemistry and Electrochemical Engineering, edn. 2, p. 49 (1962).
N. Ibl, P.H. Javet and F. Stonel, Electrochim. Acta, 17, 733 (1972).
J. Lipkowski and P.N. Ross,Adsorption of Molecules at Metal Electrodes, VCH Publishers, New York, Weinheim, Cambridge (1992).
W. Plieth, Electrochim. Acta, 37, 2115 (1992).
L. Oniciu and L. Muresan, J. Appl. Electrochem., 21, 565 (1991).
T.C. Franklin, Plat. Surf. Finish., 4, 62 (1994).
S. Trasatti, Electrochim. Acta, 37, 2137 (1992).
L. Bonou, M. Eyraud, R. Denoyel and Y. Massiani, Electrochim. Acta, 47, 4139 (2002).
A.M. Ahmed and S.M. Zourab, Z. Metalkide, 74, 476 (1988).
A.M. Ahmed, Bull. Electrochem. (India), 5, 212 (1989).
A.M. Ahmed, Bull. Electrochem. (India), 6, 528 (1990).
A.M. Ahmed, N.H. EI-Hammamy, E.A. Hamed and H.M. Abdelfattah, J. Alex. Eng., 30, 81 (1991).
A.M. Ahmed and H.M. Faid-allah, Bull. Electrochem. (India), 3, 255 (1987).
S.S. Abd El-Rehim, S.M. Sayyah and M.M. EI-Deeb, Appl. Surf, Sci., 165, 249 (2000).
A.-M.M. Ahmed, A.A.-H. Abdel-Rahman and A.F. El-Adl, J. Dispersion Sci. Technol., 31, 3 (2010).
S. Vurvara, L. Muresan,A. Nicoara, G. Maurin and I.C. Popescu, Mater. Chem. Phys., 72, 332 (2001).
N. Hackerman, Corrosion, 18, 3321 (1962).
B.G. Atya, B.E. EI-Anadouli and F.M. EI-Nizamy, Corros. Sci., 24, 321 (1984).
X.L. Cheng, H.Y. Ma, S.H. Chen, R. Yu, X. Chen and Z.M. Yao, Corros. Sci., 41, 321 (1999).
M. Bouayed, H. Rabaa, A. Srhiri, J.Y. Saillard, A.B. Bachirand and A.L. Beuze, Corros. Sci., 41, 501 (1999).
A.N. Frumkin, Z. Phys. Chem., 116, 446 (1925).
O. lkeda, H. Jimbo and H. Jaumura, J. Electroanal. Chem., 137, 127 (1982).
R. Parsons, J. Electroanal. Chem., 7, 136 (1964).
J.O.M. Bockris and D.A.J. Swinkels, J. Electrochem. Soc., 111, 736 (1964).
B.G. Ateya, B.E. El-Anadouli and F.M. El-Nizamy, Corros. Sci., 24, 509 (1984).
V. Chandradrase and K. Kannan, Bull. Electrochem. (India), 20, 471 (2004)
E.E. Oguize, B.N. Okolue, C.E. Ogukwe, A.I. Onuchukwu and C. Unaegbu, Bull. Electrochem., 20, 421 (2004).
E.E. Ebenso, U.J. Ekpe, B.I. Ita, O.E. Offiong and U.J. Ibok, Mater. Chem. Phys., 60, 79 (1999).
E.E. Ebenso, Bull. EIectrochem., 19, 209 (2003).
M.A. Quraishi and R. Sardar, Bull. Electrochem., 18, 515 (2002).
D.R. Russev, J. Appl. Electrochem., 11, 177 (1980).
Y. Ogata, K. Yamakawa and S. Yoshizawa, J. Appl. Electrochim., 13, 611 (1983).
M.I. Ismmail and T.Z. Fahidy, J. Appl. Electrochem., 11, 543 (1981).
P.H. Strickland and F. Lawson, Proc. Aust. Inst. Min-Met., 236, 25 (1970).
J.D. Talati and J.M. Darji, J. Indian Chem. Soc., 65, 94 (1988).
M. Mousa, M.M. EI-Banna and I.A.S. Monsour, Bull. Electrochem., 7, 164 (1991).