A Study on Curing between Shellac and Polyamide Resin by Dielectric Measurements
Corresponding Author(s) : P.C. Jha
Asian Journal of Chemistry,
Vol. 15 No. 3 (2003): Vol 15 Issue 3
Abstract
A study was done to investigate the curing between shellac and
polyamide resin, in solution stage by the measurement of dissipation
factor (tan δ ) at 100 kHz. It was found that the measurement of
dissipation factor with time can be conveniently used for the determination
of cure time of shellac polyamide resin blend.
Keywords
Shellac
Polyamide resin
Dielectric measurements
Prasad, K., & Jha, P. (2010). A Study on Curing between Shellac and Polyamide Resin by Dielectric Measurements . Asian Journal of Chemistry, 15(3), 1831–1833. Retrieved from https://asianpubs.org/index.php/ajchem/article/view/21916
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