Curing and Thermal Behaviour of N,N'-Diglycidyl benzophenone Tetracarboxydiimide Resin Using Mixture of Nadic/or Maleic Anhydride and 4,4'-Diaminodiphenylsulphone
Corresponding Author(s) : Gagan Deep
thareja_gagan@yahoo.co.in
Asian Journal of Chemistry,
Vol. 23 No. 10 (2011): Vol 23 Issue 10
Abstract
Curing studies of N,N'-diglycidyl benzophenone tetracarboxydiimide epoxy resin in the presence of maleic anhydride/or nadic anhydride or mixture of maleic anhydride/nadic anhydride: 4,4'- diaminodiphenyl sulfone in varying molar ratios were investigated using differential scanning calorimetry. Thermal stability of the isothermally cured resins was evaluated by thermogravimetry.
Keywords
Epoxy resin
Curing behaviour
Thermal stability
Kumar, V., Kumar, L., & Deep, G. (2011). Curing and Thermal Behaviour of N,N’-Diglycidyl benzophenone Tetracarboxydiimide Resin Using Mixture of Nadic/or Maleic Anhydride and 4,4’-Diaminodiphenylsulphone. Asian Journal of Chemistry, 23(10), 4583–4586. Retrieved from https://asianpubs.org/index.php/ajchem/article/view/10901
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