Preparation of CuO Thin Film with Corncob-Like Morphology via Chemical Solution Processing
Ling Xu1
1School of Materials & Chemical Engineering, Anhui University of Architecture, Hefei 230022, P.R. China
2Anhui Key Laboratory of Advanced Building Materials, Anhui University of Architecture, Hefei 230022, P.R. China
*Corresponding author: Fax: +86 551 3828106; Tel: +86 551 3828152; E-mail: xuhaiyan@aiai.edu.cn
Hai-Yan Xu1
1School of Materials & Chemical Engineering, Anhui University of Architecture, Hefei 230022, P.R. China
2Anhui Key Laboratory of Advanced Building Materials, Anhui University of Architecture, Hefei 230022, P.R. China
*Corresponding author: Fax: +86 551 3828106; Tel: +86 551 3828152; E-mail: xuhaiyan@aiai.edu.cn
Shi-Biao Wu1
1School of Materials & Chemical Engineering, Anhui University of Architecture, Hefei 230022, P.R. China
2Anhui Key Laboratory of Advanced Building Materials, Anhui University of Architecture, Hefei 230022, P.R. China
*Corresponding author: Fax: +86 551 3828106; Tel: +86 551 3828152; E-mail: xuhaiyan@aiai.edu.cn
Xu-Dong Wang1
1School of Materials & Chemical Engineering, Anhui University of Architecture, Hefei 230022, P.R. China
2Anhui Key Laboratory of Advanced Building Materials, Anhui University of Architecture, Hefei 230022, P.R. China
*Corresponding author: Fax: +86 551 3828106; Tel: +86 551 3828152; E-mail: xuhaiyan@aiai.edu.cn
Tian Cao1
1School of Materials & Chemical Engineering, Anhui University of Architecture, Hefei 230022, P.R. China
2Anhui Key Laboratory of Advanced Building Materials, Anhui University of Architecture, Hefei 230022, P.R. China
*Corresponding author: Fax: +86 551 3828106; Tel: +86 551 3828152; E-mail: xuhaiyan@aiai.edu.cn
Shao-Feng Zhu2
1School of Materials & Chemical Engineering, Anhui University of Architecture, Hefei 230022, P.R. China
2Anhui Key Laboratory of Advanced Building Materials, Anhui University of Architecture, Hefei 230022, P.R. China
*Corresponding author: Fax: +86 551 3828106; Tel: +86 551 3828152; E-mail: xuhaiyan@aiai.edu.cn
Yan Li1
1School of Materials & Chemical Engineering, Anhui University of Architecture, Hefei 230022, P.R. China
2Anhui Key Laboratory of Advanced Building Materials, Anhui University of Architecture, Hefei 230022, P.R. China
*Corresponding author: Fax: +86 551 3828106; Tel: +86 551 3828152; E-mail: xuhaiyan@aiai.edu.cn
Asian Journal of Chemistry,
Vol. 23 No. 5 (2011): Vol 23 Issue 5
Uniform and crack-free cupric oxide (CuO) films have been prepared by chemical bath deposition method simply using Cu(NO3)2 and ammonia. Crystal structure and morphology of the deposited CuO films were characterized by XRD and SEM. The results illustrate that well defined nanostructured CuO thin film with unique morphologies can be deposited onto glass slide substrate at 40-80 ºC for 1-5 h with pH value ranging from 8.5-10. Unique elliptic sheet-like morphology can be obtained at higher temperature (³ 70 ºC), while interesting corncob-like nano-structured CuO film can be obtained at lower temperature (£ 60 ºC). Ammonia is the key parameter to the film deposition. It has much effect on morphology of the obtained film in the range of 2.6-3.0 mL, as well as not on deposition duration.
Keywords
NanostructureChemical bath depositionCuOThin film.
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Xu1, L., Xu1, H.-Y., Wu1, S.-B., Wang1, X.-D., Cao1, T., Zhu2, S.-F., & Li1, Y. (2011). Preparation of CuO Thin Film with Corncob-Like Morphology via Chemical Solution Processing. Asian Journal of Chemistry, 23(5), 2295–2298. Retrieved from https://asianpubs.org/index.php/ajchem/article/view/10292
