Parashar, Vijay, Parveen Kukreja, and A.K. Narula. “Curing and Thermal Properties of Epoxy Resin Containing Nanosilica Particles”. Asian Journal of Chemistry 22, no. 5 (March 30, 2010): 3973–3980. Accessed June 30, 2024. https://asianpubs.org/index.php/ajchem/article/view/11637.